Vertical Transistor Devices, Memory Arrays, And Methods Of Forming Vertical Transistor Devices

ABSTRACT

A vertical transistor device includes a line of active area adjacent a line of dielectric isolation. A buried data/sense line obliquely angles relative to the line of active area and the line of dielectric isolation. A pair of gate lines is outward of the buried data/sense line and obliquely angle relative to the line of active area and the line of dielectric isolation. A vertical transistor channel region is within the active area between the pair of gate lines. An outer source/drain region is in the active area above the channel region and an inner source/drain region is in the active area below the channel region. The inner source/drain region is electrically coupled to the buried data/sense line. Other devices and structures are contemplated, as are methods of forming a plurality of vertical transistor devices.

RELATED PATENT DATA

This patent resulted from a continuation application of U.S. patent application Ser. No. 13/215,981, filed Aug. 23, 2011, entitled “Vertical Transistor Devices, Memory Arrays, And Methods Of Forming Vertical Transistor Devices”, naming Kuo Chen Wang, Sriraj Manavalan, and Wei Ming Liao as inventors, the disclosure of which are incorporated by reference.

TECHNICAL FIELD

Embodiments disclosed herein pertain to vertical transistor devices, to memory arrays, and to methods of forming vertical transistor devices.

BACKGROUND

Integrated circuits may be formed on a semiconductor substrate such as a silicon wafer or other semiconductive material. In general, layers of various materials which are semiconductive, conductive, or electrically insulative are used to form the integrated circuits. By way of examples, the various materials may be doped, ion implanted, deposited, etched, grown, etc. using various processes. A continuing goal in semiconductor processing is to strive to reduce the size of individual circuitry components, thereby enabling smaller and denser integrated circuitry. One type of component used in integrated circuitry is a transistor.

Memory is one type of integrated circuitry, and is used in computer systems for storing data. Memory may be fabricated in one or more arrays of individual memory cells. Memory cells may be written to or read from using digit lines (which may also be referred to as bit lines, data lines, sense lines, or data/sense lines) and access lines (which may also be referred to as gate lines or word lines). The digit lines may electrically interconnect memory cells along columns of the array, and the access lines may electrically interconnect memory cells along rows of the array. Each memory cell may be uniquely addressed through the combination of a digit line and an access line.

Memory cells may be volatile, semi-volatile, or non-volatile. Non-volatile memory cells can store data for extended periods of time, in many instances including when the computer is turned off. Volatile memory dissipates and therefore requires being refreshed/rewritten, in many instances multiple times per second. Regardless, memory cells are configured to retain or store memory in at least two different selectable states. In a binary system, the states are considered as either a “0” or a “1”. In other systems, at least some individual memory cells may be configured to store more than two levels or states of information.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic top plan view of an array of vertical transistor devices in accordance with an embodiment of the invention.

FIG. 2 is a sectional view taken through line 2-2 in FIG. 1.

FIG. 3 is a sectional view taken through line 3-3 in FIG. 1.

FIG. 4 is a sectional view taken through line 4-4 in FIG. 1.

FIG. 5 is a sectional view taken through line 5-5 in FIG. 1.

FIG. 6 is a sectional view taken through line 6-6 in FIG. 1.

FIG. 7 is a sectional view taken through line 7-7 in FIG. 1.

FIG. 8 is another diagrammatic top plan view of the array of FIG. 1, but where many components have been removed solely for clarity to show example location of structure not otherwise viewable in FIG. 1.

FIG. 9 is a reduced scale diagrammatic top plan view of a substrate fragment in process for producing the structure of FIGS. 1-7.

FIG. 10 is a view of the FIG. 9 substrate at a processing step subsequent to that shown by FIG. 9.

FIG. 11 is a view of the FIG. 10 substrate at a processing step subsequent to that shown by FIG. 10.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Embodiments of the invention include vertical transistor device constructions, pluralities of vertical transistor devices, memory arrays which include a plurality of vertical transistor devices, and methods of forming a plurality of vertical transistor devices. In this document, vertical is a direction generally orthogonal to a primary surface relative to which the substrate is processed during fabrication and which may be considered to define a generally horizontal direction. Further, “vertical” and “horizontal” as used herein are generally perpendicular directions relative one another independent of orientation of the substrate in three dimensional space. Further, words such as “underlying”, “outward”, “beneath”, “above”, and “elevationally” are relative terms corresponding to the vertical direction with respect to the structure being described.

Example embodiments of a vertical transistor device, including a plurality of such devices, are initially described with respect to a portion of a substrate 10 shown in FIGS. 1-7. Substrate 10 may comprise a semiconductor substrate. In the context of this document, the term “semiconductor substrate” or “semiconductive substrate” is defined to mean any construction comprising semiconductive material, including, but not limited to, bulk semiconductive materials such as a semiconductive wafer (either alone or in assemblies comprising other materials thereon), and semiconductive material layers (either alone or in assemblies comprising other materials). The term “substrate” refers to any supporting structure, including, but not limited to, the semiconductive substrates described above.

Substrate 10 comprises a suitable base substrate 12 which may be homogenous or non-homogenous, for example comprising multiple different composition materials and/or layers. As an example, such may comprise both monocrystalline silicon and/or a semiconductor-on-insulator substrate. Base substrate 12 comprises semiconductive material 14, for example monocrystalline or polycrystalline silicon, gallium arsenide, indium phosphide, or any other existing or yet-to-be-developed material possessing semiconductor properties, including any combinations of such materials. In one example, semiconductor material 14 comprises bulk monocrystalline silicon lightly background doped with a p-type conductivity modifying impurity.

Substrate 10 includes active area lines 16 which alternate with dielectric isolation lines 18 (FIG. 1). Dielectric material of the dielectric isolation lines may be homogenous or non-homogenous, with an example material 19 of isolation lines 18 including doped or undoped silicon dioxides, silicon nitrides, and any combinations thereof. Active area may be considered as a combination of materials or regions 38, 32, 14, 40, and 48 (described subsequently), with material/region 38 as active area being viewable in FIG. 1.

Lines 16 and/or 18 may be straight linear as shown. Alternately by way of example, lines 16 and/or lines 18 may not be straight linear, for example respectively extending longitudinally curvilinear (not shown). Lines 16 and/or lines 18 might have substantially vertical sidewalls (as shown) or non-vertical sidewalls (not shown), for example tapering laterally inward to be increasingly narrower deeper within substrate 10. Each of active area lines 16 may be of constant and/or the same maximum widths (e.g., at the elevationally outermost surface of substrate 10 taken perpendicular to the longitudinal orientation of the line). Dielectric isolation lines 18 may be of constant and/or the same maximum width (e.g., at the elevationally outermost surface of substrate 10 taken perpendicular to the longitudinal orientation of the line). Further, the maximum widths of active area lines 16 and dielectric isolation lines 18 may be the same or different. In one embodiment, the maximum widths of the active area lines are the same relative one another and the maximum widths of the dielectric isolation lines are the same relative one another. In one embodiment, the active area lines are from 1.1 to 1.4 times wider than the dielectric isolation lines. Example maximum widths for active area lines 16 and dielectric isolation lines 18 are from about 80 Angstroms to about 800 Angstroms. An example depth of the deepest portion of dielectric isolation lines 18 from the outermost surface of substrate 10 is from about 2,000 Angstroms to about 6,000 Angstroms.

Substrate 10 includes buried data/sense lines 20 that obliquely angle relative to active area lines 16 and dielectric isolation lines 18. An example oblique angle is from about 10° to about 60°. Lines 20 comprise one or more conductive materials, for example conductively doped semiconductor materials, elemental metals, alloys of elemental metals, and/or conductive metal compounds. Examples include one or more of titanium, titanium nitride, tungsten, and ruthenium. Buried data/sense lines 20 may be longitudinally straight, curvilinear, or of other configuration(s). Further, buried data/sense lines 20 may be of the same maximum and/or minimum widths, or of different maximum and/or minimum widths, relative one another. An example elevational thickness for buried data/sense lines 20 is from about 150 Angstroms to about 1,000 Angstroms, and an example maximum width is from about 100 Angstroms to about 800 Angstroms. Dielectric material 22 is over data/sense lines 20. Such may be homogenous or non-homogenous, and may comprise one or more of the same materials, or different materials, as dielectric isolation material 19.

Substrate 10 includes pairs 29 of gate lines 28 outward of buried data/sense lines 20 and which obliquely angle relative to active area lines 16 and dielectric isolation lines 18. Individual vertical transistor channel regions 32 (FIGS. 2, 3, 6, and 7) are within the active area between gate lines 28 of individual pairs 29 of gate lines 28. Gate lines 28 may be of the same or different dimensions relative one another, and may be of the same or different composition from that of buried data/sense lines 20. An example elevational thickness for gate lines 28 is from about 200 Angstroms to about 1,200 Angstroms, and an example maximum width is from about 30 Angstroms to about 250 Angstroms. In one embodiment, gate lines 28 within pairs 29 are parallel and longitudinally straight relative one another. In one embodiment, buried data/sense lines 20 are perpendicular relative to pairs 29 of gate lines 28. A gate dielectric 34 is between gate lines 28 and channel regions 32. Such may comprise silicon dioxide, silicon nitride, and other high k dielectrics, including combinations thereof. Dielectric material 36 is over gate lines 28. Such may be homogenous or non-homogenous, and may be of the same composition(s) as dielectric isolation 19 and/or dielectric material 22.

Substrate 10 includes pairs of outer source/drain regions 38 and inner source/drain regions 40 (FIGS. 2, 3, 6, and 7) within or as part of the active area above and below, respectively, individual channel regions 32. Inner source/drain regions 40 individually electrically couple to individual buried data/sense lines 20. In one embodiment, inner source/drain regions 40 are directly against the individual buried data/sense lines 20, and may be considered as comprising buried data/sense line contacts. In this document, a material or structure is “directly against” another when there is at least some physical touching contact of the stated materials or structures relative one another. In contrast, “over” encompasses “directly against” as well as constructions where intervening material(s) or structure(s) result(s) in no physical touching contact of the stated materials or structures relative one another. Source/drain regions 38, 40 together may be primarily of opposite conductivity type and greater dopant concentration to that of channel region 32. Buried data/sense lines 20 may be considered as individually comprising opposing sidewalls 42 and a base 44 (FIG. 7). In one embodiment, inner source/drain regions 40 are directly against a data/sense line sidewall 42, and in one embodiment against both sidewalls 42, of individual buried data/sense lines 20. In one embodiment, inner source/drain regions 40 are directly against a buried data/sense line base 44 of individual buried data/sense lines 20.

In one embodiment, a doped isolation region 48 (FIGS. 2, 3, 5, 7, and 8) is provided within lines 16 of active area (e.g. within material 14) between immediately adjacent buried data/sense lines 20. FIG. 8 is like FIG. 1 and provided to show relative example positioning of isolation implant regions 48. However, numerous components from FIG. 1 are not shown in FIG. 8 solely for purpose of clarity in showing example regions 48. Isolation regions 48 may comprise conductivity enhancing dopant opposite in type to that of source/drain regions 38, 40; of lower, the same, or higher concentration as that of regions 38, 40; and of higher dopant concentration and the same type as that of channel regions 32. An example dopant concentration for isolation regions 48 is from about 5×10¹⁷ ions/cm³ to about 2×10¹⁹ ions/cm³. Doped isolation regions 48 may be provided to preclude significant current leakage, and thereby provide isolation, between immediately adjacent data/sense lines relative to or through semiconductor material 14.

In one embodiment, some of the outer source/drain regions have outer target contact areas having trapezoidal shaped perimeters when considered or viewed horizontally. In one embodiment, some of the outer source/drain regions have respective outer target contact areas having pentagonal shaped perimeters when considered or viewed horizontally. For example referring to FIG. 8, some trapezoidal shaped target contact areas 50 and some pentagonal shaped target contact areas 52 are shown with respect to source/drain regions 38.

In one embodiment, individual charge storage components are electrically coupled to individual outer source/drain regions 38. FIGS. 2, 3, 6, and 7 schematically show example charge storage components in the form of capacitors 54. The charge storage component may be directly against outer source/drain region 38. In one embodiment, the charge storage component is directly against both outer source/drain region 38 and dielectric isolation 19. In one embodiment, an outer source/drain region 38 has an outer target contact area having a trapezoidal shape perimeter considered horizontally or a pentagonal shape perimeter considered horizontally, with the charge storage component being directly against only a portion of the outer target contact area. As examples, FIG. 1 shows example actual contact areas 85 of capacitors 54 with source/drain regions 38 which are in the form of circles. Other shapes and/or sizes may be used or result for the actual contact areas.

Example individual vertical transistor devices are shown within respective outlines 60 in FIGS. 6 and 7. In one embodiment, individual devices 60 may comprise a memory cell. In one embodiment, individual devices 60 may occupy an area averaging slightly more than 4F² of horizontal area, where “F” is the minimum lateral feature dimension of the smallest feature that is formed using feature edges of a mask pattern that is received outwardly of material from which the smallest features are formed.

An example vertical transistor device in accordance with one embodiment of the invention comprises a line of active area adjacent a line of dielectric isolation. A buried data/sense line is obliquely angled relative to the line of active area and the line of dielectric isolation. A pair of gate lines is outward of the buried data/sense line and is obliquely angled relative to the line of active area and the line of dielectric isolation. A vertical transistor channel region is within the active area between the pair of gate lines. An outer source/drain region is in the active area above the channel region and an inner source/drain region is in the active area below the channel region. The inner source/drain region is electrically coupled to the buried data/sense line. Other attributes as described above may be used.

In one embodiment, the line of active area comprises a first line of active area and further comprises a second line of active area. The first and second lines of active area are on opposing sides of the line of dielectric isolation. The buried data/sense line is directly against each of the first and second lines of active area. In one embodiment, the vertical transistor device further comprises semiconductive material beneath and interconnecting the first and second lines of active area, with the buried data/sense line having a base directly against the semiconductive material. The buried data/sense line may also comprise opposing sides individually directly against one of the first and second lines of active area.

An embodiment of the invention includes a memory array. Such comprises lines of active area alternating with lines of dielectric isolation. Buried data/sense lines obliquely angle relative to the lines of active area and the lines of dielectric isolation. Pairs of gate lines are outward of the buried data/sense lines and obliquely angle relative to the lines of active area and the lines of dielectric isolation. An individual vertical transistor channel region is within the active area between the gate lines of individual pairs of gate lines. Pairs of outer and inner source/drain regions are in the active area above and below, respectively, the individual channel regions. The inner source/drain regions individually are electrically coupled to individual buried data/sense lines.

Individual charge storage components electrically couple to individual outer source/drain regions. In one embodiment, the charge storage components are capacitors, and regardless in one embodiment the memory array comprises DRAM. In one embodiment, the memory array may comprise a doped isolation region within the lines of active area between immediately adjacent buried data/sense lines. In one embodiment, the inner source/drain regions are directly against the individual buried data/sense lines. The embodiment of FIGS. 1-8 depicts an example such memory array. Other attributes as shown in such figures and/or as described above may be used.

Embodiments of the invention include methods of forming a plurality of vertical transistor devices, as an example in forming the vertical transistor devices of FIGS. 1-7. Example precursor structures to that shown by FIG. 1 are shown in FIGS. 9-11.

Referring to FIG. 9, active area lines 16 are formed to alternate with lines 18 of dielectric isolation 19 within a semiconductor substrate.

Referring to FIG. 10, buried data/sense line trenches 90 have been etched into active area lines 16 and dielectric isolation lines 18. Buried data/sense line trenches 90 angle obliquely relative to active area lines 16 and dielectric isolation lines 18. An example angle is from about 10° to about 60° relative to horizontal in the depicted figure. Individual dielectric isolation lines 18 underlie multiple buried data/sense line trenches 90.

Referring to FIG. 11, data/sense lines 20 have been formed within buried data/sense line trenches 90. Such may be capped with dielectric material 22. Gate line trenches 95 have been etched into the semiconductor substrate. Gate line trenches 95 angle obliquely relative to active area lines 16 and dielectric isolation lines 18, and bifurcate active area 14 between two immediately adjacent data/sense lines 20. Outer source/drain regions 38, inner source/drain regions 40, and channel regions 32 may be formed within the active area, for example as shown in the FIGS. 1-7 embodiment. Further, conductive gate line pairs 29 within gate line trenches 95 may be formed, for example as also shown in the FIGS. 1-7 embodiment.

In one embodiment, a doped isolation region 48 may be formed within active area lines 16 between immediately adjacent buried data/sense lines 20, and in one embodiment between immediately adjacent inner source/drain regions 40. The forming of doped isolation regions 48 and inner source/drain regions 40 may comprise respective ion implantings. In one embodiment, the ion implanting for inner source/drain regions 40 occurs before the ion implanting for doped isolation regions 48. In one embodiment, the forming of the outer source/drain regions 38 comprises an ion implanting. In one embodiment, the ion implanting for outer source/drain regions 38 occurs after the ion implanting for doped isolation regions 48.

Any other attributes as shown and/or described with respect to FIGS. 1-8 may be used in method embodiments of the invention.

CONCLUSION

In some embodiments, a vertical transistor device comprises a line of active area adjacent a line of dielectric isolation. A buried data/sense line obliquely angles relative to the line of active area and the line of dielectric isolation. A pair of gate lines is outward of the buried data/sense line and obliquely angles relative to the line of active area and the line of dielectric isolation. A vertical transistor channel region is within the active area between the pair of gate lines. An outer source/drain region is in the active area above the channel region and an inner source/drain region is in the active area below the channel region. The inner source/drain region is electrically coupled to the buried data/sense line.

In some embodiments, a plurality of vertical transistor devices comprises lines of active area alternating with lines of dielectric isolation. Buried data/sense lines obliquely angle relative to the lines of active area and the lines of dielectric isolation. Pairs of gate lines are outward of the buried data/sense lines and obliquely angle relative to the lines of active area and the lines of dielectric isolation. An individual vertical transistor channel region is within the active area between the gate lines of individual pairs of the gate lines. Pairs of outer and inner source/drain regions are in the active area above and below, respectively, the individual channel regions. The inner source/drain regions individually are electrically coupled to individual buried data/sense lines.

In some embodiments, a memory array comprises lines of active area alternating with lines of dielectric isolation. Buried data/sense lines obliquely angle relative to the lines of active area and the lines of dielectric isolation. Pairs of gate lines are outward of the buried data/sense lines and obliquely angle relative to the lines of active area and the lines of dielectric isolation. An individual vertical transistor channel region is within the active area between the gate lines of individual pairs of the gate lines. Pairs of outer and inner source/drain regions are in the active area above and below, respectively, the individual channel regions. The inner source/drain regions individually are electrically coupled to individual buried data/sense lines. Individual charge storage components electrically couple to individual outer source/drain regions.

In some embodiments, methods of forming a plurality of vertical transistor devices are employed. Individual devices comprise an outer source/drain region, an inner source/drain region, and a channel region each formed within an active area. A plurality of gate line pairs are on opposing sides of multiple channel regions. A plurality of buried data/sense lines angle beneath the gate line pairs. The inner source/drain regions individual electrically couple to individual buried data/sense lines. Such methods form lines of active area alternating with lines of dielectric isolation within a semiconductor substrate. Buried data/sense line trenches are etched into the lines of active area and lines of dielectric isolation. The buried data/sense line trenches angle obliquely relative to the lines of active area and the lines of dielectric isolation. Individual lines of dielectric isolation underlie multiple buried data/sense line trenches. Data/sense lines are formed within the buried data/sense line trenches. Gate line trenches are etched into the semiconductor substrate. The gate line trenches angle obliquely relative to the lines of active area and the lines of dielectric isolation, and the gate line trenches bifurcate the active area between two immediately adjacent data/sense lines. The conductive gate line pairs are formed within the gate line trenches. The outer and inner source/drain regions and the channel regions are formed within the active area.

In compliance with the statute, the subject matter disclosed herein has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the claims are not limited to the specific features shown and described, since the means herein disclosed comprise example embodiments. The claims are thus to be afforded full scope as literally worded, and to be appropriately interpreted in accordance with the doctrine of equivalents. 

1-29. (canceled)
 30. A method of forming a plurality of vertical transistor devices; individual devices comprising an outer source/drain region, an inner source/drain region, and a channel region each formed within an active area; a plurality of gate line pairs on opposing sides of multiple channel regions; a plurality of buried data/sense lines angling beneath the gate line pairs; the inner source/drain regions individual electrically coupling to individual buried data/sense lines, the method comprising: forming lines of active area alternating with lines of dielectric isolation within a semiconductor substrate; etching buried data/sense line trenches into the lines of active area and lines of dielectric isolation, the buried data/sense line trenches angling obliquely relative to the lines of active area and the lines of dielectric isolation, individual lines of dielectric isolation underlying multiple buried data/sense line trenches; forming the data/sense lines within the buried data/sense line trenches; etching gate line trenches into the semiconductor substrate, the gate line trenches angling obliquely relative to the lines of active area and the lines of dielectric isolation and bifurcating the active area between two immediately adjacent data/sense lines; forming the conductive gate line pairs within the gate line trenches; and forming the outer and inner source/drain regions and the channel regions within the active area.
 31. The method of claim 30 comprising forming a doped isolation region within the lines of active area between immediately adjacent buried data/sense lines.
 32. The method of claim 31 comprising forming the doped isolation region within the lines of active area between immediately adjacent inner source/drain regions.
 33. The method of claim 31 wherein the forming the doped isolation regions and the forming the inner source/drain regions comprise respective ion implantings, the ion implanting for the inner source/drain regions occurring before the ion implanting for the doped isolation region.
 34. The method of claim 31 wherein the forming the doped isolation regions and the forming the outer source/drain regions comprise respective ion implantings, the ion implanting for the outer source/drain regions occurring after the ion implanting for the doped isolation region.
 35. The method of claim 34 wherein the forming of the inner source/drain regions comprises an ion implanting, the ion implanting for the inner source/drain regions occurring before the ion implanting for the doped isolation region.
 36. The method of claim 30 comprising forming the gate lines within individual of the pairs of gate lines to be parallel one another.
 37. The method of claim 36 comprising forming the data/sense lines to be perpendicular relative to the gate line pairs.
 38. The method of claim 30 comprising forming the data/sense lines and the gate lines to be longitudinally straight.
 39. The method of claim 30 comprising forming the inner source/drain regions to individually be directly against a sidewall of individual of the buried data/sense lines.
 40. The method of claim 30 comprising forming the gate lines within individual of the pairs of gate lines to be parallel and longitudinally straight relative one another.
 41. The method of claim 40 comprising forming the data/sense lines to be perpendicular relative to the pairs of gate lines.
 42. A method of forming a plurality of vertical transistor devices; individual devices comprising an outer source/drain region, an inner source/drain region, and a channel region each formed within an active area; a gate line operably proximate a sides of multiple channel regions; a plurality of buried data/sense lines angling beneath the gate lines; the inner source/drain regions individual electrically coupling to individual buried data/sense lines, the method comprising: forming lines of active area alternating with lines of dielectric isolation within a semiconductor substrate; etching buried data/sense line trenches into the lines of active area and lines of dielectric isolation, the buried data/sense line trenches angling obliquely relative to the lines of active area and the lines of dielectric isolation, individual lines of dielectric isolation underlying multiple buried data/sense line trenches; forming the data/sense lines within the buried data/sense line trenches; etching gate line trenches into the semiconductor substrate, the gate line trenches angling obliquely relative to the lines of active area and the lines of dielectric isolation and bifurcating the active area between two immediately adjacent data/sense lines; forming the conductive gate lines within the gate line trenches; and forming the outer and inner source/drain regions and the channel regions within the active area.
 43. The method of claim 42 comprising forming the outer source/drain regions to individually have an outer target contact area having a trapezoidal shaped perimeter considered horizontally.
 44. The method of claim 42 comprising forming the outer source/drain regions to individually have an outer target contact area having a pentagonal shaped perimeter considered horizontally.
 45. The method of claim 42 comprising forming a charge storage component electrically coupled to individual of the outer source/drain regions.
 46. The method of claim 45 wherein the charge storage component is directly against the individual outer source/drain region and directly against the dielectric isolation.
 47. The method of claim 45 wherein, the charge storage component is formed directly against the individual outer source/drain region; the individual outer source/drain region is formed to have an outer target contact area having a trapezoidal shaped perimeter considered horizontally or a pentagonal shaped perimeter considered horizontally; and the charge storage component is formed to be directly against only a portion of the individual outer target contact area.
 48. The method of claim 47 comprising forming the inner source/drain regions to be directly against bottoms of the individual buried data/sense lines.
 49. The method of claim 42 comprising forming a doped isolation region within the lines of active area between immediately adjacent buried data/sense lines. 